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Hole substrate transport device Product List

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Through-hole substrate transport device "Float Chuck LNA-S type"

Transport green sheets, through-hole substrates, breathable sheets, and non-woven fabrics without contact.

The non-contact transport device "Float Chuck LNA-S type" suspends and transports ceramic green sheets, through-hole substrates, non-woven fabrics, and breathable sheets without contact by ejecting air. The non-contact transport device "Float Chuck LNA-S type" is equipped with a nozzle that has a mechanism preventing high-speed air flow from directly colliding with the workpiece, allowing for the transport of thin, fragile green sheets with a thickness of 120μm and ultra-thin glass substrates over 50μm in thickness without damage or breakage. Additionally, the non-contact transport device "Float Chuck LNA-S type" has low air consumption and is highly efficient. ◎ Features 1. Transports and handles ceramic green sheets without contact. 2. Capable of transporting through-hole and perforated sheets. 3. Does not damage or break thin ceramic green sheets with a thickness of 120μm. 4. Capable of transporting ceramic green sheets without damage. 5. Low air consumption. 6. Does not pollute the environment.

  • Other conveying machines
  • Circuit board processing machine
  • Pneumatic Equipment
  • Hole substrate transport device

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